• Inline reflow oven
• Preheat: 7 top/7 bottom
• Solder zone: 3 above/3 below
• Power cooling with 4 zones
• Working width: 45 – 580 mm
• SMEMA interface
• Year of construction 06/2011
• Process chamber cleaned
• Condition: good
• Location warehouse
PARMI 3D SPI
Typ HS60L
• Inline paste inspection system
• Test speed: 100 cm²/s
• Circuit boards: min.50x50mm
• max. 520x510mm
• PCB thickness: 0.4- 4mm
• SMEMA interface
• Year of construction 2012
• Condition: good
• Location warehouse
