We have selective soldering unit InterSelect IS-T-300S and nitrogen generator Inmatec that we are willing to sell.

NEW Reflow Oven GT8800, UPS, Siemens, 8 zones Do sprzedaży posiadam nowy piec lutowniczy GT8800. Data produkcji 2024.

IBL Batch Vapour Phase available NOW. 100% working. Clean and including a tank filled with Soldering Liquid. Priced to go

Konfiguracja: 460SW Kompletna baza maszyny z 1 tyglem bezołowiowym i 1 fluxerem micro-drop, 1 mini fala PB, Rok produkcji: 2010

Ersa manufacturer smaller than 500kg of solder content equipped with conveyor frames ideally with flux spraying system

Two weeks ago the oven was taken out of production. 100% working condition. serviced one year ago.

We will have 1 pcs of Hotflow 2/14Asp coming in on next month. Vintage 2006. Full zones, center support, updated frequency inverters, smema, UPS. Localization : Finland

Type of machine: Reflow oven MR933+ R to L flow (9 heating / 3 cooling zones, Year of production 2013 Model: MR933+ (AIR atmosphere) Running at costumer site still Additional information: Dimmensions (WxDxH): 4.7 x 1.5 x 1.4m 2200 kg (Machine) Tech status: Producing (untill 17.01.2024) Sold AS is. Available for sale: CW03 2024

• Inline reflow oven • Preheat: 7 top/7 bottom • Solder zone: 3 above/3 below • Power cooling with 4 zones • Working width: 45 – 580 mm • SMEMA interface • Year of construction 06/2011 • Process chamber cleaned • Condition: good • Location warehouse

Konfiguracja standardowa: Integral Machine Mounted Monitor and PC Inerted Nitrogen System Auto Solder Top-up (Wire Feed) & Solder Level Detect Single Titanium Drop Jet Fluxer - 200 Micron Internal Fume Extraction Colour Programming Camera Universally Adjustable Tooling Carriers 508mm (X) x 457mm (Y) (20” x 18”) Maximum PCB Handling Size Manual Fiducial Correction System PillarPAD Offline Programming Package Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction) PillarCOMMX Windows Software Solder Wave Height Measurement Process Viewing Camera Multilevel Password Security System Lead-Free Capability Set of AP Solder Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm & 12mm) Standard Production Data Export (CSV File with Configurable Board Process Data) Accessory Kit Plus dodatkowe wyposażenie: Top Side IR Pre-Heat Closed Loop Thermocouple Top-Side Pre-Heat Control Initial Lead-Free Solder Fill – SAC305 Nitrogen Analyser - (Measures the oxygen content within the incoming nitrogen into machine). Real Time PCB Warp Correction System X, Y & Z Axis Encoders Vacuum Packaging (Jade MKII)

IBL SLC 309 Localization north of Europe.