Automatic optical inspection system Testable printed circuit boards: Components and solder joint inspection for reflow and wave applications Component failure detection: component presence or failure, placement precision and polarity, optical character recognition Solder defect detection: under/over solder, tombstone, billboard, coplanarity, raised component leads, shorts, lead-free compliant Inspection method: Orbotech's "Dimensional Picture Infomation eXtraction" (DPIX) Type: 3D Post-Reflow AOI System. One high-resolution camera for top view, 4 angled side cameras with multi-angle direct lighting Camera: 4 megapixel camera 2352x1728(top), 4 side cameras Max PCB size: 550 x 470mm, 2009

Seho 8035 Localication Europe/Poland Machine is 20 years old, with a nitrogen system installed many years ago. If interested please send an price offer.

We have a really nice SAKI AOI machine for sale. year 2013 really good condition.

All Feeders are in well condition and no missing Parts. 160 Pcs. 3X8 Silver 05/ 07 version, model 00141098 115 Pcs. 12/ 16 mm 00141092 , mixed versions 25 Pcs. 24/32 mm 00141093, mixed versions

SIEMENS ASM Type X2 • Inline SMD assembler • Portal 1 DLM3 RV12 with • Camera • 18x18 (Typ28) • Portal 2 DLM3 RV6 with camera • 27x27 (Type 27 High Resolution) • Both portals with Multicolor Cam. • Repeatability: +/- 12.5μm • PCB size (L x W) • 50x50mm2 to 450x508mm2 • Placement accuracy up to • ± 30μm, ± 0.05° at 4 sigma • Condition: very good • Location warehouse ​