SIEMENS ASM Type X2 • Inline SMD assembler • Portal 1 DLM3 RV12 with • Camera • 18x18 (Typ28) • Portal 2 DLM3 RV6 with camera • 27x27 (Type 27 High Resolution) • Both portals with Multicolor Cam. • Repeatability: +/- 12.5μm • PCB size (L x W) • 50x50mm2 to 450x508mm2 • Placement accuracy up to • ± 30μm, ± 0.05° at 4 sigma • Condition: very good • Location warehouse ​

For sale SPI kohyoung year 2007 & 2008. good rocking condition. Price 5000€ / unit

Integral PC and machine mounted TFT monitor Inerted Nitrogen system Auto solder top-up (wire feed) & solder level detect Drop-Jet fluxer Set of AP style solder nozzle tips Internal fume extraction Colour programming camera Solder wave height measurement and correction Universally adjustable tooling carrier

ERSA Ecoselect 350 Baujahr 06/2006 Semi-Automatic Selective Soldering System The solder pots are filled with: 1. Sn 63 Pb37 (1269080-00) 2. Sn 96,5 Ag 3,5 (1350857-00) Dimensions: Length: 1,350 mm Width: 2,500 mm Height: 1,330 mm Weight: approx. 900 kg / 1,300 kg (with additional soldering module) Paint: RAL 7035 / 7016 Electrical Data: Voltage: 5-wire system, 3 x 230/400 V / N / PE Power tolerance range: +6 %, -10 % Frequency: 50 or 60 Hz Power consumption: min. 7,2 - 42 kW Amperage: max. 18 - 63 A max. fuse rating: 3 x 63 A (tr) Environmental specification (factory): Ambient temperature: max. 30 °C Positioning system: 2- axis (X,Y) servo driven Z -axis, standard pneumatic driven, optional servo driven motor Positioning speed: 0.1 - 15 m/min Positioning accuracy: ± 0.25 mm Flux module: Type: high-precision spray fluxer Flux storage tank: 2 l Flux speed: 0.1 - 2.5 m/min Spray width (130 µm-nozzle): 3 - 6 mm, second nozzle available as an option Preheat module: Type: short-wave heaters Capacity: max. 10,2 kW; 6 emitters with 1700 W each Useful dimensions: 350 mm Length / 300 mm Width Type: bottom side convection Capacity: max. 3,1 kW; Useful emission space: 25 cm² Solder module 1: Capacity: approx. 3,500 W Solder volume: approx. 130 kg (when using Sn63Pb37) approx. 110 kg (when using SnAg3,8Cu0,7) Warm-up time: approx. 2 h Solder temperature: max. 300°C Solder nozzle diameter: 4.5 / 6 / 8 /10 mm additional nozzles available on request Clearance from PCB-edge: min. 3 mm Soldering speed: 0,1 - 1,0 m/min Standard: 1 soldering nozzle Optional: additional nozzles on request Solder module 2: Additional solder pot with customized nozzle plate to solder all selective soldering joints simultaneously Working window: 350 x 300 mm Type: Dip-Module Soldering nozzle: customized multi-fountain design Solder volume: ca. 350 kg (when using Sn63Pb) Solder temperature: max. 300°C Warm-up time: 2.5 hours Positioning accuracy: ± 0,25 mm