PARMI 3D SPI Typ HS60L • Inline paste inspection system • Test speed: 100 cm²/s • Circuit boards: min.50x50mm • max. 520x510mm • PCB thickness: 0.4- 4mm • SMEMA interface • Year of construction 2012 • Condition: good • Location warehouse

Ersa manufacturer smaller than 500kg of solder content equipped with conveyor frames ideally with flux spraying system

VISCOM AOI 3D Upgrade 2019 • High-end inline 3D AOI • XMplus measuring head • LP size max. 457x356mm • Test speed up to 65 cm²/s • 1 orthogonal camera • 8 oblique cameras • Resolution 10 μm • including verification station • Condition: very good • Location: Warehouse

Konfiguracja standardowa: Integral Machine Mounted Monitor and PC Inerted Nitrogen System Auto Solder Top-up (Wire Feed) & Solder Level Detect Single Titanium Drop Jet Fluxer - 200 Micron Internal Fume Extraction Colour Programming Camera Universally Adjustable Tooling Carriers 508mm (X) x 457mm (Y) (20” x 18”) Maximum PCB Handling Size Manual Fiducial Correction System PillarPAD Offline Programming Package Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction) PillarCOMMX Windows Software Solder Wave Height Measurement Process Viewing Camera Multilevel Password Security System Lead-Free Capability Set of AP Solder Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm & 12mm) Standard Production Data Export (CSV File with Configurable Board Process Data) Accessory Kit Plus dodatkowe wyposażenie: Top Side IR Pre-Heat Closed Loop Thermocouple Top-Side Pre-Heat Control Initial Lead-Free Solder Fill – SAC305 Nitrogen Analyser - (Measures the oxygen content within the incoming nitrogen into machine). Real Time PCB Warp Correction System X, Y & Z Axis Encoders Vacuum Packaging (Jade MKII)