ERSA ETS 330 Wave Soldering System 2006 Used with lead-free production PCB width max. 330mm Microprocessor Control System Foam fluxer, 12 liter tank Preheating 600-800mm Double wave solder Solder pot capacity 390kg

Integral PC and machine mounted TFT monitor Inerted Nitrogen system Auto solder top-up (wire feed) & solder level detect Drop-Jet fluxer Set of AP style solder nozzle tips Internal fume extraction Colour programming camera Solder wave height measurement and correction Universally adjustable tooling carrier

Konfiguracja standardowa: Integral Machine Mounted Monitor and PC Inerted Nitrogen System Auto Solder Top-up (Wire Feed) & Solder Level Detect Single Titanium Drop Jet Fluxer - 200 Micron Internal Fume Extraction Colour Programming Camera Universally Adjustable Tooling Carriers 508mm (X) x 457mm (Y) (20” x 18”) Maximum PCB Handling Size Manual Fiducial Correction System PillarPAD Offline Programming Package Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction) PillarCOMMX Windows Software Solder Wave Height Measurement Process Viewing Camera Multilevel Password Security System Lead-Free Capability Set of AP Solder Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm & 12mm) Standard Production Data Export (CSV File with Configurable Board Process Data) Accessory Kit Plus dodatkowe wyposażenie: Top Side IR Pre-Heat Closed Loop Thermocouple Top-Side Pre-Heat Control Initial Lead-Free Solder Fill – SAC305 Nitrogen Analyser - (Measures the oxygen content within the incoming nitrogen into machine). Real Time PCB Warp Correction System X, Y & Z Axis Encoders Vacuum Packaging (Jade MKII)

16 x 8mm 16 x 8mm 2 x 16mm + 2 x 12mm + 10 x 8mm Ustawienie skoku na 11 i 12 torze na Dipswitch Wibracyjny