Konfiguracja standardowa: Integral Machine Mounted Monitor and PC Inerted Nitrogen System Auto Solder Top-up (Wire Feed) & Solder Level Detect Single Titanium Drop Jet Fluxer - 200 Micron Internal Fume Extraction Colour Programming Camera Universally Adjustable Tooling Carriers 508mm (X) x 457mm (Y) (20” x 18”) Maximum PCB Handling Size Manual Fiducial Correction System PillarPAD Offline Programming Package Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction) PillarCOMMX Windows Software Solder Wave Height Measurement Process Viewing Camera Multilevel Password Security System Lead-Free Capability Set of AP Solder Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm & 12mm) Standard Production Data Export (CSV File with Configurable Board Process Data) Accessory Kit Plus dodatkowe wyposażenie: Top Side IR Pre-Heat Closed Loop Thermocouple Top-Side Pre-Heat Control Initial Lead-Free Solder Fill – SAC305 Nitrogen Analyser - (Measures the oxygen content within the incoming nitrogen into machine). Real Time PCB Warp Correction System X, Y & Z Axis Encoders Vacuum Packaging (Jade MKII)

IBL SLC 309 Localization north of Europe.

VISCOM X 7056 RS AOI system 3D Inline X-ray (5) Beams Software: V.SO.001 X-ray cabinet: leakage radiation

Both machines are in the same configuration, they differ in the year of production: the first machine is from 2017 and the second from 2019.