EKRA Type X5 Prof • Inline stencil printer • with EVA™ Vision System • 2½D inspection PLUS • Print format (x/y): min. 80 x 50mm • max. 460 x 460mm • Repeatability: +/- 12.5μm • SMEMA interface • LP clamping 400mm • Stencil cleaner “iROCS” • iQuess squeegee holder at front and • rear • Condition: good • Location: Customer

Automatic optical inspection system Testable printed circuit boards: Components and solder joint inspection for reflow and wave applications Component failure detection: component presence or failure, placement precision and polarity, optical character recognition Solder defect detection: under/over solder, tombstone, billboard, coplanarity, raised component leads, shorts, lead-free compliant Inspection method: Orbotech's "Dimensional Picture Infomation eXtraction" (DPIX) Type: 3D Post-Reflow AOI System. One high-resolution camera for top view, 4 angled side cameras with multi-angle direct lighting Camera: 4 megapixel camera 2352x1728(top), 4 side cameras Max PCB size: 550 x 470mm, 2009