• Inline reflow oven • Preheat: 7 top/7 bottom • Solder zone: 3 above/3 below • Power cooling with 4 zones • Working width: 45 – 580 mm • SMEMA interface • Year of construction 06/2011 • Process chamber cleaned • Condition: good • Location warehouse

SIEMENS ASM Type X2 • Inline SMD assembler • Portal 1 DLM3 RV12 with • Camera • 18x18 (Typ28) • Portal 2 DLM3 RV6 with camera • 27x27 (Type 27 High Resolution) • Both portals with Multicolor Cam. • Repeatability: +/- 12.5μm • PCB size (L x W) • 50x50mm2 to 450x508mm2 • Placement accuracy up to • ± 30μm, ± 0.05° at 4 sigma • Condition: very good • Location warehouse ​

Konfiguracja standardowa: Integral Machine Mounted Monitor and PC Inerted Nitrogen System Auto Solder Top-up (Wire Feed) & Solder Level Detect Single Titanium Drop Jet Fluxer - 200 Micron Internal Fume Extraction Colour Programming Camera Universally Adjustable Tooling Carriers 508mm (X) x 457mm (Y) (20” x 18”) Maximum PCB Handling Size Manual Fiducial Correction System PillarPAD Offline Programming Package Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction) PillarCOMMX Windows Software Solder Wave Height Measurement Process Viewing Camera Multilevel Password Security System Lead-Free Capability Set of AP Solder Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm & 12mm) Standard Production Data Export (CSV File with Configurable Board Process Data) Accessory Kit Plus dodatkowe wyposażenie: Top Side IR Pre-Heat Closed Loop Thermocouple Top-Side Pre-Heat Control Initial Lead-Free Solder Fill – SAC305 Nitrogen Analyser - (Measures the oxygen content within the incoming nitrogen into machine). Real Time PCB Warp Correction System X, Y & Z Axis Encoders Vacuum Packaging (Jade MKII)