VISCOM AOI 3D Upgrade 2019 • High-end inline 3D AOI • XMplus measuring head • LP size max. 457x356mm • Test speed up to 65 cm²/s • 1 orthogonal camera • 8 oblique cameras • Resolution 10 μm • including verification station • Condition: very good • Location: Warehouse

Ersa EWS 330 wave soldering machine. - Pallet conveyor - ESF Spray fluxer - Preheating: MW, Convection, Quartz IR, approx. 90cm - Lead free solder pot with 2 soldering waves

We assembled boards up to 0603, see photo. Year of production (board photo): 2000 - Installed options: Dispensing head to be reassembled - Installed software: (you need to plug it in to see the software) - Some photos (exterior and interior) - Date of last service: March 2024 - Additional accessories (if any): Nozzles - Price: Make an offer