We assembled boards up to 0603, see photo. Year of production (board photo): 2000 - Installed options: Dispensing head to be reassembled - Installed software: (you need to plug it in to see the software) - Some photos (exterior and interior) - Date of last service: March 2024 - Additional accessories (if any): Nozzles - Price: Make an offer

Ekra X6HSP jest z 2007 roku w dobrym stanie. Z 2,5D inspekcja pasty. x6HSP jest po Service, wszystkie węże powietrza nowe. do tego 4 komplety rakli o różnych długościach.

Good working condition. Localisation Torun Poland

ERSA Ecoselect 350 Baujahr 06/2006 Semi-Automatic Selective Soldering System The solder pots are filled with: 1. Sn 63 Pb37 (1269080-00) 2. Sn 96,5 Ag 3,5 (1350857-00) Dimensions: Length: 1,350 mm Width: 2,500 mm Height: 1,330 mm Weight: approx. 900 kg / 1,300 kg (with additional soldering module) Paint: RAL 7035 / 7016 Electrical Data: Voltage: 5-wire system, 3 x 230/400 V / N / PE Power tolerance range: +6 %, -10 % Frequency: 50 or 60 Hz Power consumption: min. 7,2 - 42 kW Amperage: max. 18 - 63 A max. fuse rating: 3 x 63 A (tr) Environmental specification (factory): Ambient temperature: max. 30 °C Positioning system: 2- axis (X,Y) servo driven Z -axis, standard pneumatic driven, optional servo driven motor Positioning speed: 0.1 - 15 m/min Positioning accuracy: ± 0.25 mm Flux module: Type: high-precision spray fluxer Flux storage tank: 2 l Flux speed: 0.1 - 2.5 m/min Spray width (130 µm-nozzle): 3 - 6 mm, second nozzle available as an option Preheat module: Type: short-wave heaters Capacity: max. 10,2 kW; 6 emitters with 1700 W each Useful dimensions: 350 mm Length / 300 mm Width Type: bottom side convection Capacity: max. 3,1 kW; Useful emission space: 25 cm² Solder module 1: Capacity: approx. 3,500 W Solder volume: approx. 130 kg (when using Sn63Pb37) approx. 110 kg (when using SnAg3,8Cu0,7) Warm-up time: approx. 2 h Solder temperature: max. 300°C Solder nozzle diameter: 4.5 / 6 / 8 /10 mm additional nozzles available on request Clearance from PCB-edge: min. 3 mm Soldering speed: 0,1 - 1,0 m/min Standard: 1 soldering nozzle Optional: additional nozzles on request Solder module 2: Additional solder pot with customized nozzle plate to solder all selective soldering joints simultaneously Working window: 350 x 300 mm Type: Dip-Module Soldering nozzle: customized multi-fountain design Solder volume: ca. 350 kg (when using Sn63Pb) Solder temperature: max. 300°C Warm-up time: 2.5 hours Positioning accuracy: ± 0,25 mm