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Dane produktu | | SOLDERING SYSTEM: WAVE, VAPOR PHASE, SELECTIVE, REFLOW - Inne sprzedam Reflow oven MR933+ R to L (9 heating / 3 cooling zones) (M2401JOZHU01) Produkt: używany Type of machine: Reflow oven MR933+ R to L flow (9 heating / 3 cooling zones,
Year of production 2013 Model: MR933+ (AIR atmosphere)
Running at costumer site still
Additional information:
Dimmensions (WxDxH): 4.7 x 1.5 x 1.4m 2200 kg (Machine)
Tech status: Producing (untill 17.01.2024) Sold AS is. Available for sale: CW03 2024 Cena: do negocjacji |
| Opis przedmiotu/usługi:
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Dane ogłaszającego: | Prześlij zapytanie:
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Inne ogłoszenia tego sprzedawcy: | | używany MECHATRONIKA Cena:: admin@smtbroker.pl |
| używany Inne there is available one Flying Probe Tester.
Vintage 2022/ 2023 ( Table Unit ) Cena:: admin@smtbroker.pl |
| używany Inne Konfiguracja standardowa:
Integral Machine Mounted Monitor and PC
Inerted Nitrogen System
Auto Solder Top-up (Wire Feed) & Solder Level Detect
Single Titanium Drop Jet Fluxer - 200 Micron
Internal Fume Extraction
Colour Programming Camera
Universally Adjustable Tooling Carriers
508mm (X) x 457mm (Y) (20” x 18”) Maximum PCB Handling Size
Manual Fiducial Correction System
PillarPAD Offline Programming Package
Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction)
PillarCOMMX Windows Software
Solder Wave Height Measurement
Process Viewing Camera
Multilevel Password Security System
Lead-Free Capability
Set of AP Solder Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm & 12mm)
Standard Production Data Export (CSV File with Configurable Board Process Data)
Accessory Kit
Plus dodatkowe wyposażenie:
Top Side IR Pre-Heat
Closed Loop Thermocouple Top-Side Pre-Heat Control
Initial Lead-Free Solder Fill – SAC305
Nitrogen Analyser - (Measures the oxygen content within the incoming nitrogen into machine).
Real Time PCB Warp Correction System
X, Y & Z Axis Encoders
Vacuum Packaging (Jade MKII) Cena:: admin@smtbroker.pl |
| używany MYDATA Cena:: admin@smtbroker.pl |
używany AOI VISCOM AOI 3D
Upgrade 2019
• High-end inline 3D AOI
• XMplus measuring head
• LP size max. 457x356mm
• Test speed up to 65 cm²/s
• 1 orthogonal camera
• 8 oblique cameras
• Resolution 10 μm
• including verification station
• Condition: very good
• Location: Warehouse Cena:: admin@smtbroker.pl |
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