SPECIAL OFFER TILL END of AUGUST!!! Instalacja I szkolenie możliwe. Instalation and training possible.

PARMI 3D SPI Typ HS60L • Inline paste inspection system • Test speed: 100 cm²/s • Circuit boards: min.50x50mm • max. 520x510mm • PCB thickness: 0.4- 4mm • SMEMA interface • Year of construction 2012 • Condition: good • Location warehouse

VISCOM AOI 3D Upgrade 2019 • High-end inline 3D AOI • XMplus measuring head • LP size max. 457x356mm • Test speed up to 65 cm²/s • 1 orthogonal camera • 8 oblique cameras • Resolution 10 μm • including verification station • Condition: very good • Location: Warehouse

ASSCON vapor phase reflow soldering systems set standards in soldering technology. The VP 2000 inline series are based on advanced patented high-tech soldering methods, and offer outstanding soldering quality in large series production. * reproducible process conditions * low energy costs thanks to smart energy management * low overall running costs * full traceability capability * product changing without waiting times