Automatic optical inspection system Testable printed circuit boards: Components and solder joint inspection for reflow and wave applications Component failure detection: component presence or failure, placement precision and polarity, optical character recognition Solder defect detection: under/over solder, tombstone, billboard, coplanarity, raised component leads, shorts, lead-free compliant Inspection method: Orbotech's "Dimensional Picture Infomation eXtraction" (DPIX) Type: 3D Post-Reflow AOI System. One high-resolution camera for top view, 4 angled side cameras with multi-angle direct lighting Camera: 4 megapixel camera 2352x1728(top), 4 side cameras Max PCB size: 550 x 470mm, 2009

Paraquda PARA-4C from 2013 Ready for shipping - installation of components per hour: 7000 according to standard - 100% vision installation - tape holders included - conveyor 4 Feeders included : - CLM950 10x8mm - CLM950 10x8mm - CLM945 24 mm - CLM952 3 x 12 / 3 x 16 mm Youtube video : https://youtu.be/GUHRPkgLE_Y

16 x 8mm 2 x 16mm + 2 x 12mm + 10 x 8mm Ustawienie skoku na 11 i 12 torze na Dipswitch Wibracyjny na laski