• Inline reflow oven • Preheat: 7 top/7 bottom • Solder zone: 3 above/3 below • Power cooling with 4 zones • Working width: 45 – 580 mm • SMEMA interface • Year of construction 06/2011 • Process chamber cleaned • Condition: good • Location warehouse

PARMI 3D SPI Typ HS60L • Inline paste inspection system • Test speed: 100 cm²/s • Circuit boards: min.50x50mm • max. 520x510mm • PCB thickness: 0.4- 4mm • SMEMA interface • Year of construction 2012 • Condition: good • Location warehouse

- F4 ( refurbished in 2004) - F25 ( vintage 2002) - S27 HM with Highcam, component sensor (vintage 2006) Waffeltray WPW 28 tray - Feeders (62x 3x8mm gold/silver, 54x 2x8mm, 23x 12/16mm, 6x 24/32mm, 4x 44mm, 2x 56mm, 22x ) - Saki BF planet X2 ( vintgae 2015) - Viscom S3088 Ultra Chroom AIO ( vintage 2020)