VISCOM AOI 3D Upgrade 2019 • High-end inline 3D AOI • XMplus measuring head • LP size max. 457x356mm • Test speed up to 65 cm²/s • 1 orthogonal camera • 8 oblique cameras • Resolution 10 μm • including verification station • Condition: very good • Location: Warehouse

Ersa manufacturer smaller than 500kg of solder content equipped with conveyor frames ideally with flux spraying system

ERSA ETS 330 Wave Soldering System 2006 Used with lead-free production PCB width max. 330mm Microprocessor Control System Foam fluxer, 12 liter tank Preheating 600-800mm Double wave solder Solder pot capacity 390kg

16 x 8mm 2 x 16mm + 2 x 12mm + 10 x 8mm Ustawienie skoku na 11 i 12 torze na Dipswitch Wibracyjny na laski