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| Dane produktu |  | TRANSPORTER - transportery sprzedam Loader/Unloader EMB LPE-3M / EMB LPA-3M (M2408WILBE02) Produkt: używany EMB LPE-3M : 2000€
EMB LPA-3M : 2000€ Cena: do negocjacji Price: 2000€ |
| | Opis przedmiotu/usługi:
| EMB company
EMB, a leading PC board assembly and manufacturing equipment manufacturer, offers a wide range of high-quality products that meet the industry standards. Their analogues include LPE-3M and PB500/3-AP systems, which are highly regarded for their efficiency and reliability. The LPE-3M system is a versatile PC board assembly machine that provides precise and accurate placement of components on the board. It boasts advanced features like automatic optical inspection and support for various PCB sizes. The system ensures faster production with minimized errors, resulting in optimal throughput and reduced costs. Another notable system is the PB500/3-AP, which is specially designed for prototype and small batch production. It offers high-speed pick-and-place capabilities along with a user-friendly interface. The system supports both SMT and through-hole components, making it suitable for diverse assembly requirements. With its compact design and advanced process control, the PB500/3-AP system delivers exceptional performance while saving valuable factory space. EMB's PC board assembly and manufacturing units come with several advantages. These machines offer increased production efficiency, improved component placement accuracy, and reduced cycle times. They also provide advanced error detection and correction mechanisms, ensuring high-quality output. EMB tools are compatible with various PCB sizes and component types, making them suitable for a wide range of assembly needs. In summary, EMB's PC board assembly and manufacturing assets, such as the LPE-3M and PB500/3-AP, offer exceptional performance, reliability, and flexibility. These models help improve productivity, reduce costs, and enhance the overall quality of PCB assembly for various applications. | | Galeria: | |
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| Inne ogłoszenia tego sprzedawcy: |  | używany Inne Automatic Optical Inspection (AOI) system 2D
Statistical Process Control (SPC)
Board size inspection area: 21" x 21"
Board inspection area: 1.96" x 1.96"
Camera resolution: 2352 x 1728
Pixel size: 8 µm
Operating system: Windows XP
SMEMA2
Power supply: 115 V, 50 Hz, 10 A Cena:: admin@smtbroker.plPrice: 12.000€ |
 | używany SPI available in september 2023. Cena:: admin@smtbroker.pl |
 | używany Inne We have a Wave soldering KINCE almost new for sale.
The machine has tin ledfree.
Bardzo zadbana Fala do lutowania (prawie nowa). Maszyna zawiera cyna bezołowiowa. Przez 4 lata nie pracowala.
Zapraszamy Cena:: admin@smtbroker.pl |
 | używany printer serviced every year. Cena:: admin@smtbroker.plPrice: 7000€ |
 | używany ERSA Ecoselect 350
Baujahr 06/2006
Semi-Automatic Selective Soldering System
The solder pots are filled with:
1. Sn 63 Pb37 (1269080-00)
2. Sn 96,5 Ag 3,5 (1350857-00)
Dimensions: Length: 1,350 mm Width: 2,500 mm Height: 1,330 mm Weight: approx. 900 kg / 1,300 kg (with additional soldering module) Paint: RAL 7035 / 7016 Electrical Data: Voltage: 5-wire system, 3 x 230/400 V / N / PE Power tolerance range: +6 %, -10 % Frequency: 50 or 60 Hz Power consumption: min. 7,2 - 42 kW Amperage: max. 18 - 63 A max. fuse rating: 3 x 63 A (tr) Environmental specification (factory): Ambient temperature: max. 30 °C Positioning system: 2- axis (X,Y) servo driven Z -axis, standard pneumatic driven, optional servo driven motor Positioning speed: 0.1 - 15 m/min Positioning accuracy: ± 0.25 mm Flux module: Type: high-precision spray fluxer Flux storage tank: 2 l Flux speed: 0.1 - 2.5 m/min Spray width (130 µm-nozzle): 3 - 6 mm, second nozzle available as an option Preheat module: Type: short-wave heaters Capacity: max. 10,2 kW; 6 emitters with 1700 W each Useful dimensions: 350 mm Length / 300 mm Width Type: bottom side convection Capacity: max. 3,1 kW; Useful emission space: 25 cm² Solder module 1: Capacity: approx. 3,500 W Solder volume: approx. 130 kg (when using Sn63Pb37) approx. 110 kg (when using SnAg3,8Cu0,7) Warm-up time: approx. 2 h Solder temperature: max. 300°C Solder nozzle diameter: 4.5 / 6 / 8 /10 mm additional nozzles available on request Clearance from PCB-edge: min. 3 mm Soldering speed: 0,1 - 1,0 m/min Standard: 1 soldering nozzle Optional: additional nozzles on request Solder module 2: Additional solder pot with customized nozzle plate to solder all selective soldering joints simultaneously Working window: 350 x 300 mm Type: Dip-Module Soldering nozzle: customized multi-fountain design Solder volume: ca. 350 kg (when using Sn63Pb) Solder temperature: max. 300°C Warm-up time: 2.5 hours Positioning accuracy: ± 0,25 mm Cena:: admin@smtbroker.pl |
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