Automatic optical inspection system Testable printed circuit boards: Components and solder joint inspection for reflow and wave applications Component failure detection: component presence or failure, placement precision and polarity, optical character recognition Solder defect detection: under/over solder, tombstone, billboard, coplanarity, raised component leads, shorts, lead-free compliant Inspection method: Orbotech's "Dimensional Picture Infomation eXtraction" (DPIX) Type: 3D Post-Reflow AOI System. One high-resolution camera for top view, 4 angled side cameras with multi-angle direct lighting Camera: 4 megapixel camera 2352x1728(top), 4 side cameras Max PCB size: 550 x 470mm, 2009

ERSA ETS 330 Wave Soldering System 2006 Used with lead-free production PCB width max. 330mm Microprocessor Control System Foam fluxer, 12 liter tank Preheating 600-800mm Double wave solder Solder pot capacity 390kg

V-TEK TM330 V-TEK component counter with heat sealers (new) for different reels: 1x 12mm 2x 16mm 1x 24mm 1x 32mm Year: 1999

We have a Wave soldering KINCE almost new for sale. The machine has tin ledfree. Bardzo zadbana Fala do lutowania (prawie nowa). Maszyna zawiera cyna bezołowiowa. Przez 4 lata nie pracowala. Zapraszamy