VISCOM AOI 3D
Upgrade 2019
• High-end inline 3D AOI
• XMplus measuring head
• LP size max. 457x356mm
• Test speed up to 65 cm²/s
• 1 orthogonal camera
• 8 oblique cameras
• Resolution 10 μm
• including verification station
• Condition: very good
• Location: Warehouse
ERSA ETS 330 Wave Soldering System 2006
Used with lead-free production
PCB width max. 330mm
Microprocessor Control System
Foam fluxer, 12 liter tank
Preheating 600-800mm
Double wave solder
Solder pot capacity 390kg
